RANGE OF PRODUCTS
Micro-CT
3D micro-CT (micro-computed tomography) is a non-destructive imaging technique that uses X-rays to generate high-resolution three-dimensional views of an object’s internal structure. It enables detailed analysis of materials, biological specimens, and industrial components without physical sectioning, preserving sample integrity. It usually uses a micro-nano focus X-ray source with a resolution of micron or sub-micron.
nano-Voxel1000
Closed Tube 90~110kV
Small footprint
Recommended for low density, small samples e.g bones, plants

nano-Voxel1000 series
nanoVoxel-2000
Closed Tube, 130kV/150kV
Recommended Applications: Polymers, Life Science, Materials, Additive manufacturing

nano-Voxel2000 series
nano-Voxel3000
Open Tube 160~240kV
Recommended Applications: Geology, Automobile, Oil & Gas, Materials, Additive manufacturing

nano-Voxel3000 series
nano-Voxel4000
Open Tube, 160~300kV
Recommended Applications: Automobile, Geology, Additive Manufacturing, Semiconductor, Lithium-Ion battery research

nano-Voxel4000 series
nano-Voxel5000
Dual X-Ray Source combining high resolution with high penetration
Recommended Applications: Automobile, Geology, Additive Manufacturing, Semiconductor, Lithium-Ion battery research

nano-Voxel5000 series
Industrial-CT
Industrial CT usually uses a high power X-ray source, with strong penetrating ability. These systems are engineered for larger, often cylindrical or industrial-sized parts, focusing on non-destructive testing (NDT), quality assurance, and process control in manufacturing environments
multiscale Voxel series
multiscale Voxel 1000,2000
Closed Tube, 450/500/600 kV

multiscale Voxel1000/2000
AcceleraXVoxel
Linear Accelerator
1~15MeV

AcceleraXVoxel
Dedicated CT
A range of dedicated CT (computed tomography) systems designed for specialized industrial and research applications, emphasizing precise, non-destructive 3D imaging and analysis. This range includes specialized solutions such as the Cylindscan series for cylindrical or slender samples, EFPscan systems for high-speed, high-resolution inspection of large-area plate samples, and metroVoxel for high-precision metrology and full-scale internal measurements. These systems are engineered to address unique challenges in quality control, research and development, and process optimization across industries like electronics, automotive, materials science, and manufacturing.
In-Line 3D Axi
PCBA/SMT: 130kV
IGBT Module: 180kV

Off-line 3D Axi
PCBA: 2D and 3D CT
Wafer-level packaging: High resolution 2D and 3D CT

Small Animal CT series
